思澈科技软件开发工具包  2.20
ble_gap_bond_req_data_t Union Reference

Bond procedure requested information data. More...

#include <bf0_ble_gap.h>

Data Fields

uint8_t auth_req
 Authentication level (. More...
 
uint8_t key_size
 LTK Key Size (if request = GAPC_LTK_EXCH)
 
uint8_t tk_type
 
ble_gap_oob_t oob_data
 Addition OOB Data for the OOB Conf and Rand values.
 
ble_gap_nc_t nc_data
 Numeric Comparison Data.
 

Detailed Description

Bond procedure requested information data.

Field Documentation

◆ auth_req

uint8_t ble_gap_bond_req_data_t::auth_req

Authentication level (.

See also
gap_auth) (if request = GAPC_PAIRING_REQ)

◆ tk_type

uint8_t ble_gap_bond_req_data_t::tk_type

Device IO used to get TK: (if request = GAPC_TK_EXCH)

  • GAP_TK_OOB: TK get from out of band method
  • GAP_TK_DISPLAY: TK generated and shall be displayed by local device
  • GAP_TK_KEY_ENTRY: TK shall be entered by user using device keyboard

The documentation for this union was generated from the following file: